BERGQUIST LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal reliability.

This material is specially designed to provide effective electronic component cooling capability for 5G base station and remote antenna assembly where a highly reliable vertical gap stability is required. It is most effective for gaps as narrow as
TYPICAL APPLICATIONS
■ RRU/AAU/BBU in wireless in telecom wireless infrastructure
■ Filling various gaps between heat-generating devices to heat sinks
■ Devices requiring low assembly pressure
■ High value assemblies with rework