• Ideal for all rework, solder, de-solder and reflow applications
• Non-corrosive, non-conductive, no-clean
• Tack flux will not run all over PCB when applied
• Excellent wetting
• Easily cleaned with isopropyl alcohol (IPA)
• Attachment of BGA spheres
• Soldering flip chip components
• Long stencil life, Wide process window
• Halogen Free (EN14582 test method)
• Clear residue
• Can be used with Leaded and Lead-Free applications
• RoHS 3 and REACH compliant

The NC191-30CC smooth flow technology a lower density flux vehicle for better shear spread and improved flow during heating.

• 30cc syringe
• Ideal for all rework, solder, de-solder and reflow applications
• Non-corrosive, non-conductive, no-clean
• Tack flux will not run all over PCB when applied
• Excellent wetting
• Flux Classification: ROL0
• Stencil Life:
  • >8 hours @ 20-50% RH 22-28°C (72-82°F)
  • >4 hours @ 50-70% RH 22-28°C (72-82°F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Store refrigerated or at room temperature 3-25°C (37-77°F). Do not freeze. Allow 4 hours for flux to reach an operating temperature of 20-25°C (68-77°F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground or air will not impact this product’s stated shelf life.